November 1, 2023
Thermal cycling testing aims to determine the ability of parts and solder interconnects to resist extremely high and low temperatures and their ability to endure cyclical exposures to extreme temperatures. Permanent changes to the electrical or physical characteristics of the devices under test that compromise their long or short-term reliability can result from the effect of thermal-induced mechanical stresses.
Thermal mismatches of materials can cause, among other things, solder joint cracking, hermetic seal failures, and damage to leads and markings.
Cycling rates and other test conditions for components, boards, solder interconnects, and/or tin whiskers evaluation can be specified. The manufacturer specifies operating and storage temperature limits to be considered.
Temperature and humidity test chamber
Thermal cycling is carried out on non-polarized parts within extreme storage temperatures, which in absolute terms exceed the operating temperatures. Alternatively, wider temperature ranges can be selected if the test purpose is a validation of the part’s ability to survive under certain conditions that exceed their maximum rating:
The test chamber can provide and control the specified temperatures in the working zones. Parts are placed in such a position concerning the airstream that there is substantially no obstruction to the airflow across and around the part. When special mounting is required, it should be specified.
The tested devices are subjected to a certain number of thermal cycles to predict and evaluate their resistance to undesirable effects such as the following:
• Cracking or fracture of materials or assemblies due to dimensional changes caused by thermal expansion or contraction
• Short-circuiting of electrical wiring
• Overheating of materials or assemblies due to changes in convection heat transfer characteristics
Temperature and humidity test chamber
After completion of the final cycle, an external visual inspection of the marking is performed in addition to other specified measurements. After subjection to the test, failure of one or more specified end-point measurements or examinations, evidence of defects or damage to the case, leads, or seals, or illegible markings is considered a failure.
The thermal cycling test plays a crucial role in ensuring the quality and reliability of electronic products. Understanding the significance of this test, COMIT takes pride in providing high-quality solutions for thermal cycling tests, including environmental test chambers. Additionally, we offer comprehensive solutions for smart factories in the field of electronics manufacturing, ranging from 2D/3D dimensional measurements (shape comparison/measurement, video measurement systems, microscope measurement systems, etc.) to X-ray/3D CT inspections, encompassing NDT technology, X-ray, and 3D CT, as well as reliability tests such as vibration tests, mechanical shock tests, drop tests, and other specialized tests.